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1 OZ / 35 µM Copper Single Layer Pcb Board , Power Bank Circuit Board 1.6 MM
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Brand Name:LEFANG
Model Number:LF6001L390
Certification:ISO9001, ISO14001, ISO/TS16949, SGS, UL, RoHs,OHSAS18000
Price:Negotiable
Payment Terms:T/T, Western Union, Paypal
Supply Ability:290, 000sqm Per Month
Delivery Time:2-10 work days
Company Data
Active Member
Contact Person
Cyan Hong
Business Type:
86--18926003312
Business Type:
Manufacturer
Officials:
A1-405 (Exit A, Fuyong Metro Station), Fuhai Information Port, Bao'an District, Shenzhen. 10mins from Shenzhen Bao'an International Airport by subway
Quality:
Quality Certifitation Available
Product Details
Company Profile
Product Details
Single Sided PCB for Power Bank Power Supply Circuit Board
The single sided power bank PCB Board is built with 22F raw
material, with 1.6 mm board thickness. The size of this 1 layer PCB
board is 8 * 80 mm, with blue solder mask and osp surface
treatment. The minimum aperture is 0.4 mm. We offer you ODM or OEM
service of consumer electonics applications.
How to get quick quotation?
| Step 1 Please send us Gerber file with these format: .CAD / .Gerber / .PCB / .DXP / .P-CAD, etc | ||||||||||||||||||||
| Step 2 Also please provide us the below details for quick quotation: | ||||||||||||||||||||
Board material: Fr - 4 / CEM - 1 / CEM - 3 / 22F / Fr - 1 / others | ||||||||||||||||||||
| Material brand: SY / KB / Rogers (optional) | ||||||||||||||||||||
| Material Specification:High Tg / copper based / aluminum based or others (optional) | ||||||||||||||||||||
| Board thickness: 0.1 - 6.0 mm | ||||||||||||||||||||
| Copper thickness: 0.05 Oz - 8 Oz ( 17 um - 288 um ) | ||||||||||||||||||||
| Surface Treatment: OSP / ENIG / HASL / Lead Free HASL / Immersion Tin / Immersion Sin | ||||||||||||||||||||
| Color of solder mask and silk print: Green / red / blue / black / white / yellow ,etc | ||||||||||||||||||||
| Board size and quantity | ||||||||||||||||||||
If you don't have Gerber file, please provide us the imfomation as step 2 or post your PCB Board to us for clone. | ||||||||||||||||||||
SAMPLE: | ||||||||||||||||||||
| ||||||||||||||||||||
Technical Data
No. | Item | Data |
| 1 | Layer count | 1-20 layers |
| 2 | Raw material type | Halogen free FR-4, high Tg FR-4, thick copper FR-4, CEM-3, copper based, aluminum based |
| 3 | Raw material brand | Rogers,Isola,Arlon, ITEQ, Hitachi, SY, KB,etc |
| 4 | Board thickness | 0.1-6.0mm |
| 5 | Max board size | 600 mm * 700 mm |
| 6 | Solder mask | Green, red, blue, black, white, yellow |
| 7 | Surface treatment | HASL/HASL lead free , OSP, Immersion gold / silver / tin , gold plating (hard gold and soft gold), silver plating, tin plating, platinum plating, carbon ink, and ENEPIG(electroless nickel - electroless palladium - immersion gold) |
| 8 | Copper thickness | 0.05 Oz - 8 Oz (17 um-288 um ) |
| 9 | Min Line width /space | 0.065 mm / 0.065 mm |
| 10 | Finished hole size | 0.10 - 5.95 mm |
| 11 | Blind/buried via | 0.10 mm |
| 12 | Aspect ratio | 10:1 |
| 13 | PTH tolerance | + / - 0.05 mm |
| 14 | Hole location tolerance | + / - 0.05 mm |
| 15 | Impedance control tolerance | + / - 8% mm |
| 16 | Outline tolerance | + / - 0.10 mm |
Lead Time
| Layer count | Sample lead time/workday | Batch lead time/workday |
| 1-2L | 2 | 6 |
| 4L | 5 | 8 |
| 6L | 5 | 9 |
| 8L | 6 | 10 |
| 10L | 8 | 10 |
| 12L | 8 | 12 |
| 14L | 10 | 15 |
| 16L | 10 | 18 |
| 18-40L (Up to difficulty) | at least 18 | at least 24 |
| P.S. For HDI, Blind/Buried Hole PCB: Regular Lead Time + 3 workdays | ||
How many advanced automated equipments do we have?
-- We have spent massively on purchasing below advanced automated production equipments.
| Equipment Name | Plant in Shenzhen | Plant in Dongguan |
| CCD exposure machine | 8 | 12 |
| AOI test machine | 6 | 8 |
| Mechanical drilling rig | 26 | 53 |
| Automatic edge finishing machine | 2 | 2 |
| Pressing machine | 2 | 2 |
| VCP | 0 | 2 |
| Electroplating line | 1 | 2 |
| CNC routing machine | 12 | 12 |
| Automatic tester | 10 | 16 |
Now send us your inquiry, and you will be replied within 8 hours!
Little knowledge - Multilayer PCB Board
Multilayer printed circuit boards (Multilayer PCBs) represented the
next major evolution in fabrication technology.
A very sophisticated and complex methodology came from the base
platform of double sided plated.
This methodology would again allow circuit board designers a
dynamic range of interconnects and applications.
Multilayer PCB board were essential in the advancement of modern
computing, and their basic construction and fabrication are similar
to micro chip fabrication on a micro size.
The range of material combinations is extensive from basic epoxy
glass to exotic ceramic fills, and it can be built on ceramic,
copper, and aluminum. Also, blind and buried vias are commonly
produced in multilayer pcb manufacturing, along with pad on via
technology.
Company Profile
Shenzhen Lefang Electronics Co., Ltd
Established in 1999, we own 3 modern factories in China.
Guangdong province - Shenzhen PCB Factory and Dongguan PCB Factory.
The total production capacity is 290,000 sqm/month.
Our main product is high precision multilayer circuit board.
Also we are experienced in PCBA.
Advanced equipment and professional technical support provide quality product.
Certifications obtained include :
ISO9001:2008 |
ISO 14001:2004 |
ISO/TS16949:2009 |
UL |
QC080000 |
OHSA18000 |
CQC |
We sincerely pursue win-win business with customer all the time!
Send your message to this supplier
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